JCET Group Co., Ltd.

JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit back-end and technology services in China, South Korea, the United States, and internationally. The company offers turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments; design solutions; and characterization services, such as mold flow, mechanical, and electrical analysis, as well as thermal analysis test. It also provides packaging solutions comprising wirebond, flip chip, wafer level, power device, and MEMS and sensors packaging, as well as wafer bumping, system-in-package, and advancement of mainstream package; and testing solutions, which include test platform, wafer sort, test development, and ITMS, as well as RF, mixed-signal, memory/3D, digital, strip, post, and final tests. In addition, the company is involved in sewage treatment; investment activities; and trading. Its products are used in automotive, computing, storage, edge AI, and power and energy applications. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. JCET Group Co., Ltd. was founded in 1972 and is based in Jiangyin, China.

JCET Group Co., Ltd.는 자회사들과 함께 중국, 한국, 미국 및 국제적으로 집적회로 후공정 및 기술 서비스를 제공합니다. 당사는 반도체 패키지 통합 설계, 웨이퍼 프로빙, 범핑, 어셈블리, 최종 테스트 및 전 세계 직배송을 포함한 턴키 솔루션, 설계 솔루션, 그리고 몰드 플로우, 기계적, 전기적 분석은 물론 열 분석 테스트와 같은 특성 분석 서비스를 제공합니다. 또한 와이어 본딩, 플립 칩, 웨이퍼 레벨, 전력 소자, MEMS 및 센서 패키징은 물론 웨이퍼 범핑, 시스템 인 패키지, 주류 패키지 기술 고도화를